虚拟仿真研究所

籍超越

发布时间:2025年03月12日 16:21    作者:    来源:    点击率:

籍超越

职 称:讲师

办公地址:逸夫楼310

电子邮件:jichaoyue@tyust.edu.cn

教育背景

2018.09 - 2023.12,武汉大学,动力工程及工程热物理,博士

2015.09 - 2018.06,太原理工大学,机械工程,硕士

2011.09 - 2015.06,太原理工大学,机械设计制造及自动化,学士

工作履历

2024.11 - 至今 英国365平台,英国上市365平台,讲师

教学工作

1)任教课程

本科生课程:《机械原理》

科研工作

1)研究领域

智能制造中的材料微观结构调控

2)承担项目

3)代表性成果

论文:

[1]Chaoyue Ji; Xintian Cai; Zhen Zhou; Fang Dong; Sheng Liu; Bing Gao ; Effects of intermetallic compound layer thickness on the mechanical properties of silicon-copper interface, Materials & Design, 2021, 212: 110251 (SCI)

[2]Chaoyue Ji; Xintian Cai; Zhen Zhou; Bing Gao; Sheng Liu ; Effects of atomic ratio on the mechanical properties of amorphous silicon carbon nitride, Materials, 2022, 15(19): 6865 (SCI)

[3]Chen Zhang; Junkai Zhu;Chaoyue Ji; Yuzheng Guo; Rui Fang; Shuwen Mei; Sheng Liu ; Laser powder bed fusion of high-entropy alloy particle-reinforced stainless steel with enhanced strength, ductility, and corrosion resistance, Materials & Design, 2021, 209: 109950 (SCI)

[5]Xintian Cai;Chaoyue Ji; Changkai Li; Zhiqiang Tian; Xuan Wang; Cheng Lei; Sheng Liu; Multiphoton absorption simulation of sapphire substrate under the action of femtosecond laser for larger density of pattern-related process windows, Micromachines, 2021, 12(12): 1571 (SCI)

[4]Ji, Chaoyue; Wang, Shizhao; Cai, Xintian; Wang, Zhen; Liu, Sheng ; Temperature Dependence of Thermal Conductivity for Low-κ Dielectric Materials, 2023 24th International Conference On Electronic Packaging Technology, ICEPT, Shihezi City, China, 2023-8-8至2023-8-11 (EI)

[6]Wei Yu;Chaoyue Ji; Xuhao Wan; Zhaofu Zhang; John Robertson; Sheng Liu; Yuzheng Guo; Machine‐learning‐based interatomic potentials for advanced manufacturing, International Journalof Mechanical System Dynamics, 2021, 1(2): 159-172

[7]籍超越,吕凯波,袁红兵, 廉自生. CST行星轮系均载特性的有限元分析研究[J].机械传动, 2018, 42 (05): 82-85

专利:

[1] 刘胜;籍超越;王诗兆;等.集成电路互连介质材料的孔隙对性能影响的评价方法, 2023-03-27,中国, CN202310328365.6 (专利)

[2]刘胜;籍超越;王诗兆;等. Cu互连中介质材料的分子动力学仿真方法, 2023-03-27,中国, CN202310328609.0 (专利)

研究生招生方向:

智能制造、机械设计、多场多尺度仿真